宁圃奇(宁圃奇)
VLoG
次浏览
更新时间:2023-05-20
宁圃奇
宁圃奇,男,工学博士,中国科学院电工研究所副研究员,2014入选中组部“青年”。
基本信息
外文名 | Ning Puqi |
国籍 | 中国 |
学业信息
毕业院校 | 清华大学 |
职业信息
职称 | 副研究员 |
基本资料
教育背景
2004年毕业于清华大学电机系获工学学士;
2006年毕业于清华大学电机系获工学硕士学位;
2010年获美国弗吉尼亚理工大学电气与计算机工程系工学博士学位。
学术方向
1)宽禁带半导体前沿探索;
2)功率模块封装新技术;
3)高功率密度变频器。
代表论著
P. Ning, F. Wang, and K. D. T. Ngo, "Forced-Air Cooling System Design Under Weight Constraint for High-Temperature SiC Converter," IEEE Trans. on Power Electronics, Vol.29,issue 4, pp.1998-2007, April,2014
P. Ning, Di Zhang, Rixin Lai, Dong Jiang, Fred Wang, Dushan Boroyevich, Rolando Burgos, Kamiar Karimi, Vikram Immanue, and Eugene Solodovnik, " Development of a 10 kW High Temperature, High Power Density Three-Phase AC-DC-AC SiC Converter," IEEE Industrial Electronics Magazine, Vol. 7, issue 1,pp. 6-17, March, 2013
P. Ning, F. Wang, and K. Ngo, "Automatic Layout Design for Power Module," IEEE Trans. on Power Electronic, Vol. 28, issue 1, pp. 481-487, Jan, 2013.
P. Ning, F. Wang, and K. Ngo, "High Temperature SiC Power Module Electrical Evaluation Procedure," IEEE Trans. on Power Electronics, Vol. 26, issue 11, pp. 3079-3083, Nov, 2011.
P. Ning, G. Lei, F. Wang, G. Lu, K. Ngo, and K. Rajashekara, "A Novel High-Temperature Planar Package for SiC Multichip Phase-Leg Power Module", IEEE Trans. on Power Electronics, Vol.25, issue 8, pp. 2059 – 2067, Aug, 2010.
P. Ning, R. Lai, D. Huff, F. Wang, K. Ngo, K. Karimi, and V. Immanuel, "SiC Wirebond Multi-Chip Phase-Leg Module Packaging Design and Testing for Harsh Environment," IEEE Trans. on Power Electronics, Vol. 25, issue 1, pp. 16-23, Jan, 2010.